StarIC
Electro-photonic interconnect

Interconnects for
Intelligence.

StarIC provides the IP, platforms, and design expertise to build high-speed transceivers, SerDes, and silicon photonic systems for AI, HPC, data centers, and Physical AI, with IP spanning advanced CMOS and electro-photonic processes. We architect the link from chip to system. For novel PHY or transceiver architectures, our custom silicon team architects multi-domain designs from scratch.
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The bridge

The Bridge Between Electronics and Photonics.

StarIC architects the full electro-photonic link across monolithic silicon, multi-die, and 3D-stacked assemblies, with a silicon-proven IP library and one multi-domain team from chip to system. When catalog blocks fit, we integrate; when they don't, we design from scratch. Depth spans SerDes, data converters, photonic interfaces, and foundational AMS, from catalog IP to custom PHY.
Electronics
High-speed AMS · silicon-proven
8 blocks
Photonics
Monolithic & multi-die integration
5 devices

Each cell links to a silicon IP block or the relevant library category.

Full IP library
Interconnect solutions

Built for the full reach of intelligent systems.

Electro-Optical Transceivers

Integrated photonics and electronics for high-speed, low-latency electro-optical links, monolithic and multi-die.

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Die-to-Die / Short Reach SerDes

UCIe-like short-reach links for AI, HPC, and chiplet connectivity. 32 Gbps with CTLE and CTLE+DFE variants, silicon-proven on advanced CMOS and silicon photonics platforms.

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Long-Reach SerDes

PCIe-class long-reach links for automotive, robotics, and Physical AI. Up to 32 Gbps, 4-tap Tx FIR, CTLE, 12-tap DFE targeting 30 dB insertion loss. Asymmetric full-duplex. Silicon-proven with first silicon success.

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Applications

Where our silicon goes to work.

Data Center & AI Infrastructure

Optical and electrical links for AI and HPC rack and chiplet scale-out.

High-Performance Compute

Low-latency electro-photonic links for host and accelerator die-to-die and optical paths.

Optical Transceivers & Networking

Complete electro-optical transceiver platforms across reach and data rates.

Physical AI & Robotics

Deterministic links for robotics, motion control, and edge compute.

Automotive & Zonal Architectures

High-speed backbones for software-defined vehicles and advanced driver systems.

Silicon Validated

APXpress silicon validation for Physical AI

StarIC and Inova Semiconductors achieved initial silicon validation of a jointly developed high-speed interconnect on GlobalFoundries' 22FDX® platform, demonstrating our long-reach SerDes expertise in deterministic, real-time connectivity.

APXpress ecosystem Explore APX PHY

“Interconnect is a core platform technology for intelligent systems.”

Imran Ahmed, CEO, StarIC

Discuss your interconnect program.

Talk to our team about interconnect IP, platform architecture, or a custom program.

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